|Page (1) of 1 - 05/16/18||email article||print page|
Orbotech and the Institute of Microelectronics (IME) to Develop Advanced Packaging Solutions in Fan-Out Wafer Level Packaging Joint Lab
YAVNE, Israel, May 16, 2018 /PRNewswire/ -- Orbotech Ltd., (NASDAQ: ORBK) a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products, and A*STAR's Institute of Microelectronics (IME), announced a joint lab agreement confirming Orbotech as a partner in IME's FOWLP joint lab and as a member of the IME FOWLP development line consortium.
Orbotech's Emerald™ UV Laser Drilling solution is one of the key processes available in the FOWLP joint lab development line. The Emerald delivers advanced UV drilling performance for today's most challenging IC substrate and assembly applications, including 3D packages, stacking and package on package.
The FOWLP development line at IME's facilities at Singapore Science Park II, and its new facilities at Fusionopolis Two, will allow IME and its partners to develop technologies that will serve a wide range of markets including consumer electronics, healthcare and automotive.
"Orbotech is honored to be part of IME's FOWLP development joint lab and FOWLP development line consortium," said Dr. Abraham Gross, Corporate Executive Vice President, Chief Technology Officer and Head of Innovation of Orbotech. "This collaboration builds on the long-term relationship that IME has with Orbotech's SPTS Technologies, a leading supplier of advanced packaging solutions. We are always pleased to cooperate with technology and process innovation initiatives that push the electronics packaging industry forward and enable solutions for complex challenges. The Emerald UV Laser Drilling system is just one of the building blocks that we, at Orbotech, provide to enhance the quality and efficiency of the production process for 3D IC and other complex high density packaging structures."
About Orbotech Ltd.
Orbotech Ltd. is a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products. Orbotech provides cutting-edge solutions for use in the manufacture of printed circuit boards (PCBs), flat panel displays (FPDs), and semiconductor devices (SDs), designed to enable the production of innovative, next-generation electronic products and improve the cost effectiveness of existing and future electronics production processes. Orbotech's core business lies in enabling electronic device manufacturers to inspect and understand PCBs and FPDs and to verify their quality ('reading'); pattern the desired electronic circuitry on the relevant substrate and perform three-dimensional shaping of metalized circuits on multiple surfaces ('writing'); and utilize advanced vacuum deposition and etching processes in SD and semiconductor manufacturing ('connecting'). Orbotech refers to this 'reading', 'writing' and 'connecting' as enabling the 'Language of Electronics'. For more information, visit www.orbotech.com
Cautionary Statement Regarding Forward-Looking Statements
Except for historical information, the matters discussed in this press release are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words "anticipate," "believe," "could," "will," "plan," "expect" and "would" and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements. These forward-looking statements are made based on management's expectations and beliefs concerning future events affecting Orbotech and are subject to uncertainties and factors relating to Orbotech's operations and business environment, the previously announced acquisition of Orbotech by KLA, the manner in which the parties plan to effect the transaction, including the share repurchase program, the ability to raise additional capital necessary to complete the repurchase program within the time frame expected, the expected benefits, synergies and costs of the transaction, management plans relating to the transaction, including with respect to the Company's ownership interest in Frontline, the expected timing of the completion of the transaction, the parties' ability to complete the transaction considering the various closing conditions, including conditions related to regulatory and Orbotech shareholder approvals, the plans, strategies and objectives of management for future operations, product development, product extensions, product integration, complementary product offerings and growth opportunities in certain business areas, the potential future financial impact of the transaction, and any assumptions underlying any of the foregoing. Actual results may differ materially from those referred to in the forward-looking statements due to a number of important factors, including but not limited to the possibility that expected benefits of the transaction may not materialize as expected, that the transaction may not be timely completed, if at all, that KLA-Tencor may not be able to successfully integrate the solutions and employees of the two companies or ensure the continued performance or growth of Orbotech's products or solutions, the risk that the Company may not achieve its revenue expectations within and for 2018 (including, without limitation, due to shifting move-in dates); cyclicality in the industries in which the Company operates, the Company's supply chain management and production capacity, order cancelation (often without penalty), timing and occurrence of product acceptance (the Company defines 'bookings' and 'backlog' as purchase arrangements with customers that are based on mutually agreed terms, which, in some cases for bookings and backlog, may still be subject to completion of written documentation and may be changed or cancelled by the customer, often without penalty), fluctuations in product mix within and among divisions, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate, including as a result of the United Kingdom's prospective withdrawal from the European Union (known as "Brexit") and political uncertainty in the United States, or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smart mobile devices, automotive electronics, flexible applications and devices, augmented reality/virtual reality and wearable devices, high-performance computing, liquid crystal display and organic light emitting diode screens and other sophisticated devices, the Company's global operations and its ability to comply with varying legal, regulatory, exchange, tax and customs regimes, the timing and outcome of tax audits, including the best judgment tax assessment issued by the Israel Tax Authority with respect to the audit of tax years 2012-2014 in Israel and the related criminal investigation, the Company's ability to achieve strategic initiatives, including related to its acquisition strategy, the Company's debt and corporate financing activities; the timing, final outcome and impact of the criminal matter and ongoing investigation in Korea, including any impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company's customers, which may result in monetary judgments or settlements, expenses associated with the Korean matter, and ongoing or increased hostilities in Israel and the surrounding areas.
The foregoing information should be read in connection with the Company's Annual Report on Form 20-F for the year ended December 31, 2017, and subsequent SEC filings. The Company is subject to the foregoing and other risks detailed in those reports. The Company assumes no obligation to update the information in this press release to reflect new information, future events or otherwise, except as required by law.
ORBOTECH COMPANY CONTACTS:
VP of Investor Relations
Tally Kaplan Porat
Director of Corporate Marketing
View original content:http://www.prnewswire.com/news-releases/orbotech-and-the-institute-of-microelectronics-ime-to-develop-advanced-packaging-solutions-in-fan-out-wafer-level-packaging-joint-lab-300649399.html
SOURCE Orbotech Ltd.
Copyright 2014 PR Newswire. All Rights Reserved
Related Keywords:Displays,USA,Korea,Singapore,Israel,Consumer Electronics,Business,Science,Other,